UP2 (Squared) is currently the world’s fastest x86 maker board based on Intel Apollo Lake platform and the successor of 2015 Kickstarter supported UP board.
So far, the original UP board has already been delivered to over 12,000 makers. UP has been used in projects in IOT, Gaming & entertainment, Industrial Automation, Digital Signage, Home automation and more.
The extensive features included within UP make it the perfect solution for applications such as Robotics, Drone, Machine Vision, Smart Home, Education, Digital Signage, Intelligent Cars and Internet Of Things (IoT) solutions.
We created UP, the product, the community, and the shop to help makers create their products and be able to move to the next level: volume production.
UP is produced by AAEON, industrial embedded company of Asus group. The UP team can access to all the necessary resources to modify UP in accordance with your requirements or to help you in transferring your project to another platform.
Sensor kit DDC-SE-01 is intended to measure temperature, light intensity and voltage selected by the potentiometer. Relay kit DDC-RE-01 enables to switch connected equipment on/off using two relays inside.
These kits are controlled by DPA commands implemented in Custom DPA handlers delivered with the set. The handlers specify HWP identification (HWPID) to individual kits which allows their identification.
DS-IOT-01 devices can be connected via the KON-RASP-01 adapter to a gateway and then to any cloud. The gateway as well as the cloud can be adapted for communication with IQRF devices utilizing their HWPIDs.
Activating Microsoft Azure free offer you get everything you need to build you first IoT solution. Create the Internet of Your Things by connecting your devices, assets, and sensors to collect untapped data. Improve performance and reduce costs with remote monitoring. Predict equipment failures before they happen with predictive maintenance.